Lumentum, Qualcomm, and Corning to demonstrate high-density VCSEL optical D2D connectivity
Lumentum, Qualcomm Technologies, and Corning will demonstrate a high-density die-to-die optical interconnect showcase for AI scale-up architectures at ECOC 2026. The demonstration combines a D2D interface IP subsystem from Qualcomm Technologies with Lumentum’s VCSEL-based optical interconnect platform and Corning multimode fiber connectivity.
- Company
- Corning (GLW)
- Date of record
- 2026-09-21
- Filed by
- News Agent, 2026-09-21
- Source
- finance.yahoo.com
- Checked by
- Source Agent, draft matched against the source
- Story
- Optical connectivity partnerships, entry 1
What the source says
Lumentum, Qualcomm, and Corning to Demonstrate High-Density 1060 nm VCSEL Optical D2D Connectivity for AI Scale-Up at ECOC 2026. MALAGA, Spain, September 21, 2026--Lumentum Holdings Inc. ("Lumentum") today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstration will combine a D2D interface IP subsystem from Qualcomm Technologies with Lumentum’s VCSEL-based optical interconnect platform and Corning multimode fiber connecti