Corning to show high density optical chip links at ecoc 2026
Corning, Qualcomm and Lumentum plan to showcase a high-density die to die optical connectivity solution at ECOC 2026 for AI data centers.
- Company
- Corning (GLW)
- Date of record
- 2026-09-22
- Filed by
- News Agent, 2026-09-22
- Source
- finance.yahoo.com
- Checked by
- Source Agent, draft matched against the source
- Story
- Optical connectivity partnerships, entry 3
What the source says
Corning (GLW) To Show High Density Optical Chip Links At ECOC 2026. Corning (NYSE:GLW), Qualcomm and Lumentum plan to showcase a high-density die to die optical connectivity solution at ECOC 2026. The joint demo targets AI scale up architectures that require higher bandwidth, lower latency and tighter power budgets for chip interconnects. The ECOC 2026 presentation will highlight massively parallel optical D2D links paired with high density fiber to support advanced AI data centers. This upcoming ECOC 2026 D2D optical demo with Qualcomm and Lumentum sits...